By Ken Kuang,Franklin Kim,Sean S. Cahill
RF and Microwave Microelectronics Packaging offers the newest advancements in packaging for high-frequency electronics. it's going to entice practising engineers within the digital packaging and high-frequency electronics fields and to educational researchers drawn to figuring out major matters within the advertisement quarter. It covers the newest advancements in thermal administration, electrical/RF/thermal-mechanical designs and simulations, packaging and processing equipment in addition to different RF/MW packaging-related fields.
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RF and Microwave Microelectronics Packaging by Ken Kuang,Franklin Kim,Sean S. Cahill